Encapsulation Potting Compound/RTV 2 Electronic Potting Silicone Rubber

            Encapsulantion Potting Compound/RTV 2 Silicone Rubber for                                 Electronic PottingDESCRIPTIONTwo-Part Potting/Encapsulating Compound Silicone is a room temperature cure potting

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            Encapsulantion Potting Compound/RTV 2 Silicone Rubber for                                 Electronic Potting

DESCRIPTION

Two-Part Potting/Encapsulating Compound Silicone is a room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It's suitable for encapsulating of LED displayers, power module and electronics components, etc.

FEATURES

Easy mix with 1: 1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent

USING INSTRUCTIONS

1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: Room temperature cure or heat-up cure is both workable.
4. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.


PACKING

1kg/drum, 5kg/drum, 20kg/drum,  25kg/drum and 200kg per drum.


STORAGE

1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.
Item No.MCSIL-E160
Colorgray
Mix Ratio1:1
Viscosity mPa.s 25C< 4000
Density g/cm31.57±0.02
Pot life min 25C30
Curing time  H24
Curing time with heat min 100C10
Hardness shore A55-60
Dielectric strength kv/mm 25C≥20
Volume resistivity DC500v Ω?cm3×10 15
Tensile strength Mpa≥0.6
Thermal conductivity w/m0.63
Temperature C-30-200

 

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